| 图片 |
型号 |
品牌 |
封装 |
数量 |
描述 |
PDF资料 |
|
BQ2204ASN-NTRG4 |
Texas Instruments
|
16-SOIC |
|
存储器控制器 SRAM Non-Volatile Cntrlr Unit |
|
| 参数:制造商:Texas Instruments,产品种类:存储器控制器,RoHS:是,包装形式:Reel,工厂包装数量:1,... |
|
BQ2204ASNTR |
Texas Instruments
|
16-SOIC |
|
存储器控制器 SRAM Nonvolatile Controller IC |
|
| 参数:制造商:Texas Instruments,产品种类:存储器控制器,RoHS:是,安装风格:SMD/SMT,封装形式:SOIC-16,包装形式:Reel,工厂包... |
|
BQ2204ASNTRG4 |
Texas Instruments
|
SOIC-16 |
|
存储器控制器 SRAM Nonvolatile Controller IC |
|
| 参数:制造商:Texas Instruments,产品种类:存储器控制器,RoHS:是,安装风格:SMD/SMT,封装形式:SOIC-16,包装形式:Reel,工厂包... |
|
BQ2205LYPW |
Texas Instruments
|
16-TSSOP |
808 |
存储器控制器 Battery Back-up for Dual SRAM Banks |
|
| 参数:制造商:Texas Instruments,产品种类:存储器控制器,RoHS:是,最大工作温度:+ 70 C,最小工作温度:- 20 C,安装风格:SMD/SM... |
|
BQ2205LYPWG4 |
Texas Instruments
|
16-TSSOP |
|
存储器控制器 Battery Back-up for Dual SRAM Banks |
|
| 参数:制造商:Texas Instruments,产品种类:存储器控制器,RoHS:是,最大工作温度:+ 70 C,最小工作温度:- 20 C,安装风格:SMD/SM... |
|
BQ2205LYPWR |
Texas Instruments
|
16-TSSOP |
69 |
存储器控制器 Battery Back-up for Dual SRAM Banks |
|
| 参数:制造商:Texas Instruments,产品种类:存储器控制器,RoHS:是,最大工作温度:+ 70 C,最小工作温度:- 20 C,安装风格:SMD/SM... |
|
BQ2205LYPWRG4 |
Texas Instruments
|
16-TSSOP |
|
存储器控制器 Battery Back-up for Dual SRAM Banks |
|
| 参数:制造商:Texas Instruments,产品种类:存储器控制器,RoHS:是,最大工作温度:+ 70 C,最小工作温度:- 20 C,安装风格:SMD/SM... |
|
BU9348K |
ROHM Semiconductor
|
44-QFP(10x10) |
|
存储器控制器 RAM CONTROLLER 44PIN |
|
| 参数:制造商:ROHM Semiconductor,RoHS:是,包装形式:Bulk,工厂包装数量:1000,... |
|
90-1211S-I00 |
Maxim Integrated
|
|
|
存储器控制器 Nonvolatile Controller X 8 Chip |
|
| 参数:制造商:Maxim Integrated,... |
|
SM223TX020000-AD |
Silicon Motion, Inc.
|
- |
|
CF CONTROLLER, COMMERCIAL TEMP G |
|
| 参数:Silicon Motion, Inc.|托盘|*|在售|-|-|-|-|-|-|... |
|
4DB0226KB0AVG |
Renesas Electronics America Inc
|
53-FCCSP(7.5x3) |
|
FCCSP 7.50X3.00X1.20 MM, 0.50MM |
|
| 参数:Renesas Electronics America Inc|托盘|-|在售|动态 RAM(DRAM)|1.2V|-|表面贴装型|53-TFBGA,FCCSP... |
|
4DB0232KC2AVG |
Renesas Electronics America Inc
|
253-FCCSP(8x13.5) |
|
FCCSP 7.50X3.00X1.20 MM, 0.50MM |
|
| 参数:Renesas Electronics America Inc|托盘|-|在售|动态 RAM(DRAM)|1.2V|-|表面贴装型|253-LFBGA,FCCS... |
|
4DB0226KB0AVG8 |
Renesas Electronics America Inc
|
- |
|
FCCSP 7.50X3.00X1.20 MM, 0.50MM |
|
| 参数:Renesas Electronics America Inc|卷带(TR)|-|在售|-|-|-|-|-|-|... |
|
4DB0232KC2AVG8 |
Renesas Electronics America Inc
|
- |
|
FCCSP 7.50X3.00X1.20 MM, 0.50MM |
|
| 参数:Renesas Electronics America Inc|卷带(TR)|-|在售|-|-|-|-|-|-|... |
|
DS1314S-2+T&R/C04 |
Analog Devices Inc./Maxim Integrated
|
8-SOIC |
|
3V NONVOLATILE CONT W/LITHIUM BA |
|
| 参数:Analog Devices Inc./Maxim Integrated|卷带(TR)|-|在售|非易失性 RAM|3V ~ 3.6V|-40°C ~ 85°C... |
|
SM223GX060000-AC |
Silicon Motion, Inc.
|
- |
|
4-CH CF CONTROLLER, C-TEMP |
|
| 参数:Silicon Motion, Inc.|托盘|*|在售|-|-|-|-|-|-|... |
|
4RCD0232KC1ATG |
Renesas Electronics America Inc
|
253-FCCSP(8x13.5) |
|
FCCSP 13.50X8.00X1.40 MM, 0.65MM |
|
| 参数:Renesas Electronics America Inc|托盘|-|在售|动态 RAM(DRAM)|1.2V|-|表面贴装型|253-LFBGA,FCCS... |
|
4RCD0232KC1ATG8 |
Renesas Electronics America Inc
|
253-FCCSP(8x13.5) |
|
FCCSP 13.50X8.00X1.40 MM, 0.65MM |
|
| 参数:Renesas Electronics America Inc|卷带(TR)|-|在售|动态 RAM(DRAM)|1.2V|-|表面贴装型|253-LFBGA,... |
|
CY7C68023-56LTXCT |
Infineon Technologies
|
56-QFN-EP(8x8) |
|
IC MEMORY CONTROLLERS 56QFN |
|
| 参数:Infineon Technologies|卷带(TR)|EZ-USB NX2LP?|最后售卖|NAND 闪存 - USB|3V ~ 3.6V|0°C ~ 70... |
|
PM8607B-F3EI |
Microchip Technology
|
1085-FCBGA(27x27) |
|
NVME2016 |
|
| 参数:Microchip Technology|托盘|-|在售|NVMe 控制器|-|-|表面贴装型|1085-BGA, FCBGA|1085-FCBGA(27x27... |