| 图片 | 型号 | 品牌 | 封装 | 数量 | 描述 | PDF资料 |
|---|---|---|---|---|---|---|
|
MAX35104ETL+T | Analog Devices Inc./Maxim Integrated | 40-TQFN（5x5） | TIME-TO-DIGITAL CONVERTER WITH G | ||
| 参数：Analog Devices Inc./Maxim Integrated|卷带（TR）|-|在售|飞行时间数字转换器|CMOS|CMOS|62 μA|-40°C... | ||||||
|
ADA4558WHCPZ-RL | Analog Devices Inc. | 20-LFCSP（4x4） | PRESSURE SENSOR IC W/ LIN INTERF | ||
| 参数：Analog Devices Inc.|卷带（TR）|Automotive, AEC-Q100|在售|传感器调节器|差分|LIN|7 mA|-40°C ~ 15... | ||||||
|
XR18910IL-67 | MaxLinear, Inc. | 24-QFN（3.5x3.5） | 1 | IC FRONT END W/ MUX 8:1 24QFN | |
| 参数：MaxLinear, Inc.|散装|-|Digi-Key 停止提供|前端|-|-|457 μA|-40°C ~ 85°C|表面贴装型|24-WFQFN 裸露焊... | ||||||
|
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XR18910IL-66 | MaxLinear, Inc. | 24-QFN（3.5x3.5） | 9 | IC FRONT END W/ MUX 8:1 24QFN | |
| 参数：MaxLinear, Inc.|散装|-|Digi-Key 停止提供|前端|-|-|457 μA|-40°C ~ 85°C|表面贴装型|24-WFQFN 裸露焊... | ||||||
|
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XR18910IL-64 | MaxLinear, Inc. | 24-QFN（3.5x3.5） | 1 | IC FRONT END W/ MUX 8:1 24QFN | |
| 参数：MaxLinear, Inc.|散装|-|Digi-Key 停止提供|前端|-|-|457 μA|-40°C ~ 85°C|表面贴装型|24-WFQFN 裸露焊... | ||||||
|
MLX75123SLA-ABA-000-RE | Melexis Technologies NV | 84-AQFN（7x7） | TOF COMPANION CHIP | ||
| 参数：Melexis Technologies NV|卷带（TR）|Automotive, AEC-Q100|不适用于新设计|飞行时间数字转换器|电容性|I2C|-|... | ||||||
|
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MLX75123RLA-ABA-000-RE | Melexis Technologies NV | 84-AQFN（7x7） | AUTOMOTIVE TOF COMPANION CHIP | ||
| 参数：Melexis Technologies NV|卷带（TR）|Automotive, AEC-Q100|不适用于新设计|飞行时间数字转换器|电容性|I2C|-|... | ||||||
|
AS6500-FQFM | ScioSense | 40-QFN（6x6） | AS6500-FQFM QFN40 LF T&RDP | ||
| 参数：ScioSense|卷带（TR）|-|在售|转换器|数字|SPI|100 μA|-40°C ~ 125°C（TA）|表面贴装型|40-VFQFN 裸露焊盘|40... | ||||||
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AS6501-FLQM | ScioSense | 48-QFP（7x7） | AS6501-FLQM LQFP48 LF T&RDP | ||
| 参数：ScioSense|卷带（TR）|-|在售|转换器|数字|SPI|100 μA|-40°C ~ 125°C（TA）|表面贴装型|48-LQFP|48-QFP（7... | ||||||
|
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TDC-GPX2FLQM | ams OSRAM | 64-QFP（10x10） | TDC-GPX2 FLQM LQFP64 LF T&RDP | ||
| 参数：ams OSRAM|卷带（TR）|-|在售|转换器|LVDS|LVDS|2 mA|-40°C ~ 125°C|表面贴装型|64-LQFP|64-QFP（10x1... | ||||||
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TDC-GPX2 FLQM | ScioSense | 64-QFP（10x10） | TDC-GPX2 QFN64 TRA | ||
| 参数：ScioSense|托盘|-|在售|转换器|CMOS，LVDS|LVDS，串行，SPI|100 μA|-40°C ~ 125°C（TA）|表面贴装型|64-LQ... | ||||||
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AS6040_ST_NS V1.0 | ScioSense | - | AS6040-BQFM QFN48 LF T&RDP | ||
| 参数：ScioSense|散装|-|在售|转换器|数字|SPI|80 μA|-40°C ~ 85°C（TA）|-|-|-|... | ||||||
|
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AS6031_ST_NS V1.0 | ScioSense | - | AS6031-BQFM QFN48 LF T&RDP | ||
| 参数：ScioSense|散装|-|在售|转换器|数字|SPI|80 μA|-40°C ~ 85°C（TA）|-|-|-|... | ||||||
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GH65C11-C-SS-1 | Grayhill Inc. | 20-SSOP | ENDCODER OPTICAL | ||
| 参数：Grayhill Inc.|-|65|在售|接口|-|-|-|-40°C ~ 85°C|表面贴装型|-|20-SSOP|... | ||||||
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ZOPT0210AC4C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 参数：IDT, Integrated Device Technology Inc|托盘|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3026CC1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 参数：IDT, Integrated Device Technology Inc|托盘|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3026CC6B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 参数：IDT, Integrated Device Technology Inc|托盘|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3218BI1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 参数：IDT, Integrated Device Technology Inc|托盘|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3218BI2B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 参数：IDT, Integrated Device Technology Inc|托盘|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3224BI5B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - WAFER BOX | ||
| 参数：IDT, Integrated Device Technology Inc|托盘|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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